Micro-coil with movable core for application in an inductive displacement sensor

Journal of Micromechanics and Microengineering

Volumn 9, Issue 2, 1999, Pages 119-122

  Velten, Th ^a   Stefan, D ^a   Obermeier, E ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRIC COILS; ELECTRIC RESISTANCE; ELECTRIC WINDINGS; MICROMACHINING; MICROSENSORS; PHOTORESISTS; SILICON WAFERS;

FINGER FLEXION; FLIP CHIP BONDING; INDUCTIVE DISPLACEMENT SENSOR; IRON CORE; MICROCOIL; OHMIC RESISTANCE;

MICROELECTRONICS;

EID: 0033138341     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/9/2/004     Document Type: Article

References (5)

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4. Hamasaki Y and Ide T 1995 A multi-layer eddy current micro sensor for non-destructive inspection of small diameter pipes Proc. Transducers '95 pp 136-9
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