The role of numerical stress analysis in failure analysis of a medical device

Plastics Engineering

Volumn 55, Issue 5, 1999, Pages 45-47

  Chen, Y ^a   Agarwal, B D ^a   So, Paul K ^a  

^a L J Broutman and Associates Ltd   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIOMEDICAL EQUIPMENT; COMPUTATIONAL METHODS; CRACK INITIATION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; GEL PERMEATION CHROMATOGRAPHY; MICROSCOPIC EXAMINATION; STRESS ANALYSIS; TENSILE STRESS;

MEDICAL DEVICES; NUMERICAL STRESS ANALYSIS;

PLASTIC PRODUCTS;

EID: 0033134508     PISSN: 00919578     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)