Novel optical probing and micromachining techniques for silicon debug of flip chip packaged microprocessors

Microelectronic Engineering

Volumn 46, Issue 1, 1999, Pages 27-34

  Paniccia, Mario ^a   Eiles, T ^a   Livengood, R ^a   Rao, V R M ^a   Winer, P ^a   Yee, Wai Mun ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; ETCHING; FLIP CHIP DEVICES; MICROMACHINING; MILLING (MACHINING); PROBES; SEMICONDUCTING SILICON;

FOCUSED ION BEAM MILLING; LASER CHEMICAL ETCHING; OPTICAL PROBING;

MICROPROCESSOR CHIPS;

EID: 0033131641     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(99)00009-X     Document Type: Article

References (4)

1. 1 R.H. Livengood and V.R.M Rao, Focused Ion Beam Techniques for Debug of Flip Chip Integrated Circuits" ,Semiconductor International, March 1998.
2. 2 R.H.Livengood, P.Winer and V.R.M.Rao, "Application of Advanced Micromachining Techniques for Characterization and Debug of High Performance Microprocessors" Submitted for publication in the proceedings of 42 International conference of Electron, Ion and Photon Beam Technology and Nanofabrication, May 26-29, 1998.
3. 3 M.Paniccia, V.R.M.Rao, W.M.Yee, "Optical Probing of Flip Chip Packaged Microprocessors," Submitted for publication in the proceedings of 42 International conference of Electron, Ion and Photon Beam Technology und Nanofabrication, May 26-29, 1998.
4. 4 D.J. Ehrlich, J. Y. Tsao, "A Review of Laser-Microchemical Processing", J. Vac. Sci. Technol. B1(4)Oct.-Dec. (1983).