Hydrogen incorporation and embrittlement of electroformed Au, Cu and Au-Cu

Engineering Failure Analysis

Volumn 6, Issue 2, 1999, Pages 83-92

  Bozzini, B ^a   Giovannelli, G ^a   Natali, S ^b   Brevaglieri, B ^b   Cavallotti, P L ^a   Signorelli, G ^b  

^a Dipto di Chimica Fisica Applicata   (Italy)

^b SAPIENZA UNIVERSITY OF ROME   (Italy)

Author keywords

Cracks; Decohesion; Electrodeposition; Embrittlement; Hydrogen

Indexed keywords

COMPOSITE MATERIALS; COPPER; CRACK PROPAGATION; ELECTRODEPOSITION; ELECTROFORMING; FRACTOGRAPHY; GOLD; HEAT TREATMENT; MASS SPECTROMETRY; SCANNING ELECTRON MICROSCOPY;

DECOHESION; MICROMETIC VOIDS;

HYDROGEN EMBRITTLEMENT;

COMPOSITE; ELECTRODEPOSITION; EMBRITTLEMENT; HYDROGEN EMBRITTLEMENT;

EID: 0033117814     PISSN: 13506307     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1350-6307(98)00039-9     Document Type: Article

References (10)

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