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Volumn 16, Issue 2, 1999, Pages 84-93
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IC reliability and test: What will deep submicron bring?
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
DEEP SUBMICRON TECHNOLOGY;
FAILURE ANALYSIS;
INTEGRATED CIRCUIT MANUFACTURE;
MICROPROCESSOR CHIPS;
RELIABILITY;
INTEGRATED CIRCUIT TESTING;
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EID: 0033115891
PISSN: 07407475
EISSN: None
Source Type: Journal
DOI: 10.1109/MDT.1999.765207 Document Type: Article |
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Times cited : (9)
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References (2)
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