Integration of platinum bottom electrode on poly-Si for ferroelectric thin films

Applied Surface Science

Volumn 141, Issue 1-2, 1999, Pages 77-82

  Choi, Eun Suck ^a   Yoon, Soon Gil ^a,c   Choi, Won Youl ^b   Kim, Ho Gi ^b  

^a Chungnam National University   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^c Hanyang University   (South Korea)

Author keywords

66.30.Ny; 67.70.+n; 68.35. p; 68.35.Fx; AQ; DB; EE; FBC; Ferroelectric thin films; IM; OBM; PG; PK; Platinum; Poly Si; SC; SF; SOP; TI; XBD

Indexed keywords

ANNEALING; DIELECTRIC FILMS; DIFFUSION IN SOLIDS; ELECTRODES; FERROELECTRIC MATERIALS; METALLORGANIC CHEMICAL VAPOR DEPOSITION; OXYGEN; RANDOM ACCESS STORAGE; SPUTTER DEPOSITION;

POLYSILICON;

PLATINUM;

EID: 0033100594     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(98)00623-0     Document Type: Article

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