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Volumn 11, Issue 1, 1999, Pages 15-26

Reduced temperature curing of acetylenic polyimides

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; CROSSLINKING; CURING; OLIGOMERS; THERMODYNAMIC STABILITY; THERMOPLASTICS;

EID: 0033099037     PISSN: 09540083     EISSN: None     Source Type: Journal    
DOI: 10.1088/0954-0083/11/1/015     Document Type: Article
Times cited : (3)

References (12)
  • 5
    • 0003167442 scopus 로고    scopus 로고
    • ed G A Zakrzewski et al (Corvina: Society for the Advancement of Material and Process Engineering)
    • Wood K H, Jensen B J, Young P R and McNair H M 1997 42nd Int. SAMPE Symp. ed G A Zakrzewski et al (Corvina: Society for the Advancement of Material and Process Engineering) p 1271
    • (1997) 42nd Int. SAMPE Symp. , pp. 1271
    • Wood, K.H.1    Jensen, B.J.2    Young, P.R.3    McNair, H.M.4
  • 7
    • 0009343854 scopus 로고    scopus 로고
    • International Patent Specification PCT/AU98/00147
    • Hawthorne D G and Hodgkin J H 1998 International Patent Specification PCT/AU98/00147
    • (1998)
    • Hawthorne, D.G.1    Hodgkin, J.H.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.