SETP-based modeling of die product

Gaojishu Tongxin/High Technology Letters

Volumn 9, Issue 3, 1999, Pages 15-19

  Tang, Dunbing ^a   Li, Dongbo ^a   Zhang, Shiqi ^a  

^a NANJING UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED MANUFACTURING; COMPUTER INTEGRATED MANUFACTURING; MANUFACTURE; NETWORK PROTOCOLS;

PRODUCT MODEL;

DIES;

EID: 0033086589     PISSN: 10020470     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)