Bismuth embrittlement of [011] twist boundaries in copper bicrystals

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 30, Issue 2, 1999, Pages 483-485

  Monzen, R ^a   Kuze, T ^a   Okamoto, T ^a   Miura, H ^b  

^a KANAZAWA UNIVERSITY   (Japan)

^b UNIVERSITY OF ELECTRO COMMUNICATIONS   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BISMUTH; CRYSTAL GROWTH; CRYSTAL ORIENTATION; CRYSTAL SYMMETRY; DOPING (ADDITIVES); EMBRITTLEMENT; FRACTURE; GRAIN BOUNDARIES; POLYCRYSTALS; STRAIN; STRESS ANALYSIS; THERMAL EFFECTS; BICRYSTALS; BRITTLE FRACTURE; SCANNING ELECTRON MICROSCOPY; STRAIN RATE; TENSILE STRESS; TENSILE TESTING;

BICRYSTALS; BRIDGMANN METHOD; TWIST BOUNDARIES; BISMUTH EMBRITTLEMENT; COPPER BICRYSTALS; GRAIN-BOUNDARY EMBRITTLEMENT; GRAIN-BOUNDARY ENERGY; INTERGRANULAR-FRACTURE SURFACES;

COPPER; COPPER ALLOYS;

EID: 0033079247     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-999-0338-8     Document Type: Article

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