Strain and fracture mechanism of Cu-TiC

Materials Letters

Volumn 38, Issue 4, 1999, Pages 270-274

  Besterci, Michal ^a   Ivan, Jozef ^b   Kováč, Ladislav ^a   Weissgaerber, Thomas ^c   Sauer, Christa ^c  

^a INSTITUTE OF MATERIALS RESEARCH   (Slovakia)

^b INSTITUTE OF CHEMISTRY   (Slovakia)

^c DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Dispersion strengthened Cu; Fracture mechanism; In situ tensile test in SEM

Indexed keywords

COPPER ALLOYS; DUCTILITY; FRACTURE MECHANICS; MATHEMATICAL MODELS; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; STRAIN; TENSILE STRESS; TENSILE TESTING;

FRACTURE MORPHOLOGY; TRANSCRYSTALLINE DUCTILE;

BINARY ALLOYS;

EID: 0033077484     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(98)00171-2     Document Type: Article

References (6)

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6. T. Weissgaerber et al., in: Proc. of World Conf. on Powder Metallurgy, Washington, D.C., 1996.