An Investigation of Stable Bonding for Au-Al Solid Phase Diffusion Bonding Techniques

Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi)

Volumn 82, Issue 2, 1999, Pages 11-20

  Mori, Miki ^a   Fukuda, Yumi ^a   Kizaki, Yukio ^a   Iida, Atsuko ^a   Saito, Masayuki ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

Al film thickness; Au Al junction; COG mount; Flip chip mount; Intermetallic compound; Solid phase diffusion bonding

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; DIFFUSION IN SOLIDS; ELECTRIC RESISTANCE; GOLD ALLOYS; HIGH TEMPERATURE EFFECTS; SEMICONDUCTING INTERMETALLICS;

SOLID PHASE DIFFUSION BONDING;

FLIP CHIP DEVICES;

EID: 0033077169     PISSN: 8756663X     EISSN: None     Source Type: Journal    
DOI: 10.1002/(sici)1520-6432(199902)82:2<11::aid-ecjb2>3.0.co;2-t     Document Type: Article

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