Analysis of a mold filling using an implicit sola-vof

Numerical Heat Transfer; Part A: Applications

Volumn 35, Issue 3, 1999, Pages 331-342

  Kim, Woo Seung ^a   Im, Ik Tae ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FLOW OF FLUIDS; MOLDS;

COURANT CRITERIA; MOLD FILLING PROCESS; SOFTWARE PACKAGE SOLA-VOF;

CASTING;

EID: 0033076184     PISSN: 10407782     EISSN: 15210634     Source Type: Journal    
DOI: 10.1080/104077899275272     Document Type: Article

References (14)

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