A Modular micromachined high-density connector system for biomédical applications

IEEE Transactions on Biomedical Engineering

Volumn 46, Issue 4, 1999, Pages 471-480

  Akin, Tayfun ^a,b   Ziaie, Babak ^a,b   Nikles, Stefan A ^b,c   Najafi, Khalil ^a,b,c  

^a MIDDLE EAST TECHNICAL UNIVERSITY   (Turkey)

^b UNIVERSITY OF MICHIGAN   (United States)

^c University of Michigan   (United States)

Author keywords

Biom dical microsystems; High density connectors; Im plan table devices

Indexed keywords

ELECTRODES; FUNCTIONAL ELECTRIC STIMULATION; FUNCTIONAL NEURAL STIMULATION; IMPLANTS (SURGICAL);

BIOMEDICAL MICROSYSTEMS; HIGH DENSITY CONNECTORS; IMPLANTABLE DEVICES;

BIOMEDICAL ENGINEERING;

BIOMATERIAL; GLASS; GOLD; IMIDE; SILICON; TITANIUM;

ANIMAL EXPERIMENT; ARTICLE; BIOCOMPATIBILITY; BIOMEDICAL ENGINEERING; DENSITY; ELECTRIC RESISTANCE; ELECTRONICS; ELECTROPHYSIOLOGY; GUINEA PIG; IMPEDANCE; IMPLANTATION; INTEGRATED CIRCUIT; MACHINE; MICROELECTRODE; NONHUMAN; OCCIPITAL CORTEX;

ANIMALS; ELECTRIC IMPEDANCE; ELECTRODES, IMPLANTED; ELECTROENCEPHALOGRAPHY; EQUIPMENT DESIGN; GUINEA PIGS; OCCIPITAL LOBE; PROSTHESES AND IMPLANTS; REPRODUCIBILITY OF RESULTS; SILICON; TITANIUM;

EID: 0032925904     PISSN: 00189294     EISSN: None     Source Type: Journal    
DOI: 10.1109/10.752944     Document Type: Article

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