Plasma etch residue and photoresist removal utilizing environmentally benign process chemicals

Solid State Phenomena

Volumn 65-66, Issue , 1999, Pages 143-152

  Kleemeier, W ^a   Leon, V ^b   Graham, S ^c  

^a STMicroelectronis   (United States)

^b Olin Microelectronic Materials   (United States)

^c Semitool Incorporated   (United States)

Author keywords

Aqueous; Cleaner; Environmental plasma; Etch; Ozone; Photoresist; Residue

Indexed keywords

CLEANING; ETCHING; OZONE; PHOTORESISTS; SILICON WAFERS; SOLVENTS; WASTE DISPOSAL; ANTIREFLECTION COATINGS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REACTIVE ION ETCHING; SURFACE CLEANING;

AQUEOUS; CLEANER; CLEANING CHEMISTRY; CRITICAL DIMENSION; ENVIRONMENTALLY BENIGN PROCESS; PHOTORESIST REMOVAL; RESIDUE; THROUGHPUT IMPROVEMENT;

ENVIRONMENTAL IMPACT; PLASMA ETCHING;

CRITICAL DIMENSION (CD); PLASMA ETCH RESIDUES;

EID: 0032783795     PISSN: 10120394     EISSN: 16629779     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/SSP.65-66.143     Document Type: Conference Paper

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