Transmit/receive module packaging: electrical design issues

Johns Hopkins APL Technical Digest (Applied Physics Laboratory)

Volumn 20, Issue 1, 1999, Pages 70-80

  Kopp, Brace A ^a   Moore, Craig R ^b   Coffman, Robert V ^c  

^a Microwave and RF Subsystems Section   (United States)

^b APL's Principal Professional Staff   (United States)

^c Air Defense Systems Department   (United States)

Author keywords

Microelectronics packaging; MMIC; Phased array; T R module

Indexed keywords

ANTENNA PHASED ARRAYS; COSTS; INTEGRATED CIRCUIT LAYOUT; MICROELECTRONICS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; RADAR ANTENNAS; TRANSCEIVERS;

TRANSMIT/RECEIVE MODULE;

ELECTRONICS PACKAGING;

EID: 0032763296     PISSN: 02705214     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. Laverghetta, T. S., Microwave Measurements and Techniques, Artech House, Dedham, MA (1976).
2. Wilkinson, E. J., "An N-way Hybrid Power Divider," IRE Trans. MTT, 116-118 (Jan 1965).
3. Saito, Y., Griese, R., Kessler, J., Kono, R., and Fang, J., "Hydrogen Degradation of GaAs MMICs and Hydrogen Evolution in the Hermetic Package," in Proc. IEEE Monolithic Circuits Symp., pp. 119-122 (1995).