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Volumn 36, Issue 1, 1999, Pages 52-56
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Solid state
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a
NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER;
DIELECTRIC MATERIALS;
ELECTRIC INSULATING MATERIALS;
INTEGRATED CIRCUIT MANUFACTURE;
MICROELECTROMECHANICAL DEVICES;
MICROELECTRONICS;
MICROPROCESSOR CHIPS;
SEMICONDUCTING SILICON COMPOUNDS;
SEMICONDUCTOR DEVICE MANUFACTURE;
SILICON ON INSULATOR TECHNOLOGY;
SILICON WAFERS;
WIRELESS TELECOMMUNICATION SYSTEMS;
COPPER INTERCONNECTS;
SEMICONDUCTING SILICON GERMANIDE;
SEPARATION BY IMPLANTATION OF OXYGEN (SIMOX) PROCESS;
INDUSTRIAL ELECTRONICS;
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EID: 0032762681
PISSN: 00189235
EISSN: None
Source Type: Journal
DOI: 10.1109/6.738326 Document Type: Article |
Times cited : (13)
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References (0)
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