Study on ta diffusion barrier in Al/Si system

Journal of Electronic Materials

Volumn 28, Issue 1, 1999, Pages 6-12

  Kim, Jaehwa ^a   Yoon, Dong Soo ^a   Kwak, Joon Seop ^a   Baik, Hong Koo ^a   Lee, Sung Man ^b  

^a Yonsei University   (South Korea)

^b Kangwon National University   (South Korea)

Author keywords

Al metallization; Diffusion barrier; Tantalum

Indexed keywords

ALUMINUM; DECOMPOSITION; DIFFUSION IN SOLIDS; INTERFACES (MATERIALS); METALLIZING; PHASE DIAGRAMS; SILICON; TANTALUM;

DIFFUSION BARRIERS;

METALLIC FILMS;

EID: 0032762021     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0187-7     Document Type: Article

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