Characterization of chemical polishing materials (monomodal and bimodal) by means of acoustic spectroscopy

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Volumn 158, Issue 3, 1999, Pages 343-354

  Dukhin, Andrei S ^a   Goetz, Philip J ^a  

^a Dispersion Technology Inc   (United States)

Author keywords

Chemical polishing; Model dispersion; Particle size distribution

Indexed keywords

ACOUSTIC SPECTROSCOPY; CHEMICAL POLISHING; ERROR ANALYSIS; MATHEMATICAL MODELS; PARTICLE SIZE ANALYSIS; SILICA; SLURRIES; SPECTROMETERS; ULTRASONIC MEASUREMENT;

CHEMICAL POLISHING MATERIALS; ULTRASONIC ATTENUATION SPECTROSCOPY;

COLLOIDS;

SILICON DIOXIDE;

ACCURACY; ACOUSTICS; ARTICLE; DISPERSION; MODEL; PARTICLE SIZE; PHYSICAL CHEMISTRY; PRIORITY JOURNAL; REPRODUCIBILITY; SPECTROMETRY;

EID: 0032737094     PISSN: 09277757     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0927-7757(99)00155-7     Document Type: Article

References (9)

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4. A.S. Dukhin, P.J. Goetz, Characterization of aggregation phenomena by means of acoustic and electroacoustic spectroscopy. Colloids and Surfaces, accepted, (1998).
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8. A.S. Dukhin, P.J. Goetz, US Patent pending.
9. Irani R.R., Callis C.F. Particle Size: Measurement, Interpretation and Application. 1971;John Wiley and Sons, New York-London.