The use of copper powders recycled from printed wire boards to manufacture a conductive epoxy adhesive

Journal of Environmental Science and Health - Part A Toxic/Hazardous Substances and Environmental Engineering

Volumn 34, Issue 10, 1999, Pages 2043-2059

  Hong, S G ^a   Ho, M D ^a  

^a YUAN ZE UNIVERSITY   (Taiwan)

Author keywords

Adhesive; Conductive; Copper; Printed wire board; Recycle

Indexed keywords

COPPER POWDER; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY MEASUREMENT; EPOXY RESINS; ETCHING; PLASTIC ADHESIVES; PRINTED CIRCUIT BOARDS; SHEAR STRENGTH;

LAP SHEAR STRENGTH;

RECYCLING;

COPPER; EPOXIDE; NICKEL; RESIN;

ADHESION; ARTICLE; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; ELECTRONICS INDUSTRY; RECYCLING; SHEAR STRESS;

EID: 0032722634     PISSN: 10934529     EISSN: None     Source Type: Journal    
DOI: 10.1080/10934529909376946     Document Type: Article

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