Electrolytic plating of copper for emerging computer chip interconnect technologies: Key challenges & opportunities

Proceedings of the AESF Annual Technical Conference

Volumn , Issue , 1999, Pages 129-134

  Neely, Carl ^a   Reynolds, H Vincent ^a  

^a ReynoldsTech ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATHODES; ELECTRIC CURRENTS; ELECTROPLATING; INTEGRATED CIRCUIT MANUFACTURE; MICROPROCESSOR CHIPS; SILICON WAFERS;

COMPUTER CHIP INTERCONNECT TECHNOLOGY; CONSTANT CURRENT RECTIFICATION; NON-ROTATING CATHODE TECHNOLOGY;

COPPER PLATING;

EID: 0032690835     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (0)