Forming solder joints by sintering eutectic tin-lead solder paste

Journal of Electronic Materials

Volumn 28, Issue 7, 1999, Pages 912-915

  Palmer, Mark A ^a,b   Alexander, Christy N ^b   Nguyen, Brian ^b  

^a Virginia Commonwealth University   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE PASTES; COPPER; DIFFUSION; EUTECTICS; LEAD; MELTING; OPTICAL MICROSCOPY; PARTICLES (PARTICULATE MATTER); POWDER METALS; SINTERING; TEMPERATURE; TIN;

LIQUID PHASE SINTERING; MECHANICAL INTEGRITY; TIN LEAD SOLDER PASTE;

SOLDERED JOINTS;

EID: 0032690456     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0219-3     Document Type: Article

References (5)

1. D. Napp, "High Temperature Fatigue Resistant Solder - A NCMS Project" (Paper presented at the 1997 TMS Annual Meeting, Orlando, Florida, 9-13 February 1997).
2. The Lead-free Solder Project: Final Report (City: National Center for Manufacturing Sciences, 1997).
3. R.M. German, Powder Metallurgy Science, 2nd Edition (Princeton, NJ: Metal Powder Industries Federation, 1994).
4. W.D. Kingery, H.K. Bowen, and D.R. Uhlmann, Introduction to Ceramics, 2nd Edition (New York: Wiley, 1976).
5. D. Verhoven, Fundamentals of Physical Metallurgy (New York: Wiley, 1975), p. 517.