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Volumn , Issue , 1999, Pages 784-789
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Simple evaluation methodology of Young's modulus-temperature relationship for the underfill encapsulants
a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTER SIMULATION;
ELASTIC MODULI;
ENCAPSULATION;
FINITE ELEMENT METHOD;
FLIP CHIP DEVICES;
MATHEMATICAL MODELS;
RELIABILITY;
STRAIN;
STRESS RELAXATION;
TEMPERATURE;
THERMAL CYCLING;
VISCOELASTICITY;
MODULUS TEMPERATURE RELATIONSHIP;
STRESS STRAIN RELATIONSHIP;
UNDERFILL ENCAPSULANT;
VISCOELASTIC MODEL;
ELECTRONICS PACKAGING;
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EID: 0032690052
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
Times cited : (3)
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References (8)
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