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Volumn , Issue , 1999, Pages 784-789

Simple evaluation methodology of Young's modulus-temperature relationship for the underfill encapsulants

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELASTIC MODULI; ENCAPSULATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; RELIABILITY; STRAIN; STRESS RELAXATION; TEMPERATURE; THERMAL CYCLING; VISCOELASTICITY;

EID: 0032690052     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article
Times cited : (3)

References (8)
  • Reference 정보가 존재하지 않습니다.

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.