Ceramic applications in chemical mechanical planarization

American Ceramic Society Bulletin

Volumn 78, Issue 5, 1999, Pages 97-100

  Wayne Lougher, P E ^a  

^a SpeedFam IPEC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CHEMICAL POLISHING; CHEMICAL RESISTANCE; COMPRESSIVE STRENGTH; CORROSION RESISTANCE; HARDNESS; SEMICONDUCTOR DEVICE MANUFACTURE; SOLUBILITY; SURFACE ROUGHNESS; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION;

CHEMICAL MECHANICAL PLANARIZATION (CMP); THERMAL EXPANSION COEFFICIENTS;

CERAMIC MATERIALS;

EID: 0032688301     PISSN: 00027812     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (8)

1. J. Steigerwald, Chemical Mechanical Planarization of Microelectronic Materials; pp. 1, 7. Wiley, New York, 1997.
2. "Fundamentals of Chemical Mechanical Planarization"; pp. 2.1, 2.2. PTI Seminars, Fenton, Mo., 1998.
3. R. Dornseif, "Semiconductor Equipment Manufacturing and Materials Worldwide Market Analysis," Dataquest, 6 (1998).
4. Planarization by Chemical Mechanical Polishing for Multilevel Metal Integrated Circuits. W.C. O'Mara & Associates, 1994.
5. Walter H. Gitzen (Ed.), Alumina as a Ceramic Material; p. 103, 1970.
6. Ibid.
7. L.D. Hart (Ed.), Alumina Chemicals Science and Technology Handbook; p. 17, 1990.
8. H. Landis et al., "Integration of Chemical-Mechanical Polishing into CMOS Integrated Circuit Manufacturing," Thin Film Solids, [220] 2 (1992).