Effect of the environment on the measured values of the adhesion of polyimide to silicon

Journal of Adhesion Science and Technology

Volumn 13, Issue 4, 1999, Pages 423-436

  Paek, Sang Hyon ^a   Lee, Kang Wook ^b   Durning, Christopher J ^a  

^a Och Spine at New York Presbyterian Hospitals   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

blister test; blunting of crack tip; crack opening displacement; peel test; Polyimide; stick slip

Indexed keywords

BLISTER TEST; CRACK OPENING DISPLACEMENT; CRACK OPENING DISPLACEMENTS; LIQUID ENVIRONMENT; LOCAL PLASTIC DEFORMATION; MOLECULAR SIZE; PEEL TESTS; POLYIMIDE FILM; SEVERE PLASTIC DEFORMATIONS; SILICON SUBSTRATES; WATER/METHANOL MIXTURE;

ADHESION; BOND STRENGTH (MATERIALS); CRACK TIPS; DEBONDING; LIQUIDS; METHANOL; PEELING; POLYIMIDES; POLYMERIC FILMS; SLIP FORMING; STICK-SLIP; STRESS INTENSITY FACTORS; CRACKS; PLASTIC DEFORMATION; SILICA; THIN FILMS; YIELD STRESS;

TRANSPORT PROPERTIES; ADHESION;

BLISTER TEST; BLUNTING OF CRACK TIP; CRACK OPENING DISPLACEMENT; PEEL TEST; STICK SLIP;

EID: 0032686233     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856199X00028     Document Type: Article

References (23)

1. H. Satou, H. Suzuki and D. Makino, in: Polyimides, D. Wilson, H. D. Stenzenberger and P. M. Hergenrother (Eds), pp. 227-251. Blackie, New York (1990).
2. C. Feger and H. Franke, in: Polyimides-Fundamentals and Applications, M. K. Ghosh and K. L. Mittal (Eds), pp. 759-814. Marcel Dekker, New York (1996).
3. J. E. E. Baglin, G. J. Clark and J. Bottiger, Matter Res. Soc. Symp). Proc. 25, 179 (1984).
4. K. L. Mittal, in: Adhesion Measurement of Films and Coatings, K. L. Mittal (Ed.), pp. 1-13. VSP, Utrecht ( 1995).
5. D. Maugis, J. Mater: Sci. 20, 3041 (1985).
6. A. J. Kinloch and S. J. Shaw, in: Developments in Adhesives-2, A. J. Kinloch (Ed.), p. 83-124. Elsevier Applied Science, London (1981).
7. A. N. Gent and R. P. Petrich, Proc. R. Soc. London, Ser: A 310, 433 (1969).
8. S. Mostovoy and E. J. Ripling. J. Appl. Polym. Sci. 13, 1083 (1969).
9. R. A. Gledhill, A. J. Kinloch, S. Yamini and R. J. Young, Polymer 19, 574 (1978).
10. D.-C. Hu and H.-C. Chen, J. Adhesion Sci. Technol. 6, 527 (1992).
11. H. Dannenberg, J. Appl. Polym. Sci. 5, 125 (1961 ).
12. J. L. Goldfarb, R. J. Farris. Z. Chai and F. E. Karasz, Mater. Res. Soc. Symp. Proc. 227, 335 (1991).
13. M. L. Williams, J. Appl. Polym. Sci. 13. 29 (1969).
14. A. N. Gent and L. H. Lewandowski, J. Appl. Polym. Sci. 33, 1567 (1987).
15. Y. Z. Chu and C. J. Durning, J. Appl. Polym. Sci. 45, 1151 (1992).
16. T. S. Oh, L. P. Buchwalter and J. Kim, J. Adhesion Sci. Technol. 4, 303 (1990).
17. L. P. Buchwalter, T. S. Oh and J. Kim.J. Adhesion Sci. Technol. 5, 333 (1991).
18. L. P. Buchwalter. J. Adhesion Sci. Technol. 4, 697 (1990).
19. J. A. Hinkley and S. L. Mings. Polymer 31, 75 (1990).
20. J. N. Goodier and F. A. Field, in: Fracture of Solids, D. C. Drucker and J. J. Gilman (Eds), p. 103. Wiley, New York (1963).
21. J. R. Rice.J. Appl. Moch. 35, 379 (1968).
22. S. T. Sackinger and R. J. Farris, in: Polyimides-Materials, Chemistry and Characterization, C. Feger, M. M. Khojasteh and J. E. McGrath (Eds), pp. 585-600. Elsevier Science, Amsterdam ( 1989).
23. M. H. Chipalkatti, R. J. Farris and J. M. Hutchinson, Rev. Sci. Instrum. 56, 112 (1987).