Micro-power CMOS RF front-end for embedded wireless devices

IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers

Volumn , Issue , 1999, Pages 17-20

  Rofougaran, Razieh ^a   Lin, Tsung Hsien ^a   Newberg, Fredric ^a   Kaiser, William J ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIAS; CMOS FRONT END; COFIRED CERAMIC TECHNOLOGY; EMBEDDED WIRELESS DEVICES; FRONT END DESIGN; LOW NOISE AMPLIFIERS; POWER DISSIPATION;

AMPLIFIERS (ELECTRONIC); CAPACITORS; ELECTRIC CURRENTS; ELECTRIC INDUCTORS; EMBEDDED SYSTEMS; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; MIXER CIRCUITS; TELECOMMUNICATION EQUIPMENT; TRANSCONDUCTANCE; WIRELESS TELECOMMUNICATION SYSTEMS;

CMOS INTEGRATED CIRCUITS;

EID: 0032684503     PISSN: 10972633     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RFIC.1998.682038     Document Type: Conference Paper

References (7)