Characterization of particle motion for polishing and texturing under AC field by using particle dispersion type ER fluid

Journal of Intelligent Material Systems and Structures

Volumn 9, Issue 8, 1998, Pages 672-675

  Akagami, Yoichi ^a   Asari, Koichi ^a   Jeyadevan, Balachandaran ^b   Fujita, Toyohisa ^b  

^a Akita Prefectural R&D Center Industrial Technology Center   (Japan)

^b AKITA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; DISPERSIONS; ELECTRIC FIELD EFFECTS; MICROSCOPIC EXAMINATION; PARTICLES (PARTICULATE MATTER); POLISHING; RHEOLOGY; VISCOSITY OF LIQUIDS;

ELECTRORHEOLOGICAL FLUIDS; SILICONE OIL;

SUSPENSIONS (FLUIDS);

EID: 0032684502     PISSN: 1045389X     EISSN: None     Source Type: Journal    
DOI: 10.1177/1045389X9800900815     Document Type: Article

References (4)

1. Y. Akagami, S. Nishimura, Y. Ogasawara, T. Fujita, B. Jeyadevan and K. Nuri, "Polishing of Microholes Using ER Fluid Under Alternative Electric Field" Int. Conf. on ERMR'97 1997.
2. K. Nuri and K. Itoh, Japanese Patent (submitted) 1995.
3. T. Fujita et al., J. Mining and Material Processing Institute of Japan, 105(14)1989.
4. I. J. Lin, and T. B. Jones, J. of Electrostatics, 15 (1984) 53-65.