Common and Differential Crosstalk Characterization on the Silicon Substrate

IEEE Microwave and Guided Wave Letters

Volumn 9, Issue 1, 1999, Pages 25-27

  Bockelman, David E ^b  

^a University of Florida   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CROSSTALK; ELECTRIC NETWORK ANALYZERS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR DEVICE TESTING; SILICON WAFERS;

BOND PADS; COMMON-MODE CROSSTALK; DIFFERENTIAL-MODE CROSSTALK;

INTEGRATED CIRCUIT TESTING;

EID: 0032682425     PISSN: 10518207     EISSN: None     Source Type: Journal    
DOI: 10.1109/75.752113     Document Type: Article

References (5)

1. D. K. Su, M. J. Loinaz, S. Masui, and B. A. Wooley, “Experimental results and modeling techniques for substrate noise in miced-signal interconnect circuits,” IEEE J. Solid-State Circuits, vol. 28, pp. 420-430, Apr. 1993
2. D. E. Bockelman and W. R. Eisenstadt, “Pure-mode network analyzer for on-wafer measurements of mixed-mode s-parameters of differential circuits,” IEEE Trans. Microwave Theory Tech., vol. 45, pp. 1071-1077, July 1997
3. D. E. Bockelman and W. R. Eisenstadt, “Combined differential and common-mode scattering parameters: Theory and stimulation,” IEEE Trans. Microwave Theory Tech., vol. 43, pp. 1530-1539, July 1995
4. Product Literature: Dual Model 40A Probes, GGB Industries, Naples, FL, 1996
5. D. E. Bockelman, “The theory, measurements and applications of mode specific scattering parameters with multiple modes of propagation,” Ph.D. dissertation, Univ. of Florida, May 1997