Considerations for electroplated copper for sub-micron interconnects in advanced integrated circuits

Proceedings of the AESF Annual Technical Conference

Volumn , Issue , 1999, Pages

  Gross, Mihal E ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; INTEGRATED CIRCUIT MANUFACTURE;

ABSTRACTS ONLY; ADVANCED INTEGRATED CIRCUITS; SUB-MICRON INTERCONNECTS;

COPPER PLATING;

EID: 0032681060     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (0)