Necessity of reexamining previous life prediction analyses of solder joints in electronic packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 1010-1014

  Anderson, T ^a   Guven, I ^a   Madenci, E ^a   Gustafsson, G ^a  

^a UNIVERSITY OF ARIZONA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SOFTWARE; CREEP; DIFFERENTIAL EQUATIONS; FATIGUE OF MATERIALS; SOLDERED JOINTS; STRAIN;

ANAND MODEL; INELASTIC STRAIN ENERGY DENSITY; PLASTIC WORK DENSITY;

ELECTRONICS PACKAGING;

EID: 0032681015     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (14)