Characterization of thermal residual strain in SiCp/6061 Al composites by ultramicrohardness

Journal of Materials Science Letters

Volumn 18, Issue 14, 1999, Pages 1099-1100

  Qin, Shuyi ^a   Liu, Cheng ^a   Chen, Jiayi ^a   Zhang, Guoding ^a   Wang, Wenlong ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; FINITE ELEMENT METHOD; HARDNESS TESTING; MATHEMATICAL MODELS; MICROHARDNESS; PARTICLE SIZE ANALYSIS; POISSON RATIO; RESIDUAL STRESSES; SILICON CARBIDE; STRAIN HARDENING; THERMAL STRESS;

ALUMINUM 6061; THERMAL RESIDUAL STRAIN; ULTRAMICROHARDNESS;

METALLIC MATRIX COMPOSITES;

EID: 0032678725     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1006616109746     Document Type: Article

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