Deposition of a molten layer of high melting point material: Substrate melting and resolidification

Materials Science and Engineering: A

Volumn 262, Issue 1-2, 1999, Pages 25-32

  Wang, S P ^a,b   Wang, G X ^a,c   Matthys, E F ^a  

^a University of California   (United States)

^b TSINGHUA UNIVERSITY   (China)

^c The University of Akron   (United States)

Author keywords

Coating; Deposition; Numerical study; Operational maps; Resolidification; Substrate melting

Indexed keywords

BONDING; COATING TECHNIQUES; COOLING; HEAT TRANSFER; INTERFACIAL ENERGY; MATHEMATICAL MODELS; MELTING; METALS; NUMERICAL ANALYSIS; PHASE TRANSITIONS; SOLIDIFICATION;

HIGH MELTING POINT DROPLET; OPERATIONAL MAPS; RESOLIDIFICATION; SUBSTRATE MELTING; THERMAL SPRAY PROCESSING;

DEPOSITION;

EID: 0032678160     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(98)01026-0     Document Type: Article

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