How to compare superficial and intergranular segregation? A new analysis within the mixed SMA-TBIM approach

Acta Materialia

Volumn 47, Issue 9, 1999, Pages 2705-2715

  Berthier, F ^a   Legrand, B ^b   Treglia G ^c  

^a UNIVERSITÉ PARIS SACLAY   (France)

^b SERVICE DE RECHERCHES DE MÉTALLURGIE PHYSIQUE   (France)

^c CAMPUS DE LUMINY   (France)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; COMPUTER SIMULATION; GRAIN BOUNDARIES; IMPURITIES; NUMERICAL METHODS; SEGREGATION (METALLOGRAPHY); SURFACES;

COPPER SILVER SYSTEM; INTERGRANULAR SEGREGATION; SECOND MOMENT APPROXIMATION; SEGREGATION ENERGY; SUPERFICIAL SEGREGATION; TIGHT BINDING ISING MODEL;

COPPER ALLOYS;

EID: 0032677157     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(99)00144-5     Document Type: Article

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