Mixed-mode fracture behavior of silica particulate filled epoxide resin

ASTM Special Technical Publication

Volumn , Issue 1359, 1999, Pages 129-142

  Kishimoto, Kikuo ^a   Notomi, Mitsuo ^b   Kadota, Shun ^a   Shibuya, Toshikazu ^a   Kawamura, Noriyasu ^c   Kawakami, Takashi ^c  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b MEIJI UNIVERSITY   (Japan)

^c TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; ELECTRONICS PACKAGING; EPOXY RESINS; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; SEMICONDUCTOR DEVICE MANUFACTURE; SILICA; STRESS ANALYSIS; STRESS INTENSITY FACTORS;

FAILURE CRITERION; MIXED MODE FRACTURE; SILICA FILLED EPOXY RESINS;

FRACTURE MECHANICS;

EID: 0032676898     PISSN: 10403094     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1520/stp14247s     Document Type: Article

References (10)

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