Palladium pre-plated copper leadframe for DRAM LOC packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 842-847

  Yang, Ji Cheng ^a   Lee, Kian Chai ^a   Tan, Ah Chin ^a  

^a MICRON TECHNOLOGY INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COST EFFECTIVENESS; HEAT TRANSFER; INTEGRATED CIRCUIT MANUFACTURE; PALLADIUM; RELIABILITY; SEMICONDUCTOR STORAGE; SOLDERED JOINTS; THERMAL CONDUCTIVITY;

LEAD ON CHIP; PALLADIUM PREPLATED COPPER LEADFRAME; THERMAL DISSIPATION;

ELECTRONICS PACKAGING;

EID: 0032673301     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)