Electrical characterization of metal enhanced BGA packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 848-852

  Solomon, Dawit ^a   Del Rosario, Elmer ^a   Opiniano, Ernie ^a   Wong, Jackson ^a   Pinello, William ^a  

^a HANA Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC PROPERTIES; ELECTRIC VARIABLES MEASUREMENT; FREQUENCY DOMAIN ANALYSIS; MATHEMATICAL MODELS;

METAL ENHANCED BALL GRID ARRAY PACKAGES; SIGNAL INTEGRITY SIMULATION;

ELECTRONICS PACKAGING;

EID: 0032667886     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)