Novel techniques for electronic component removal

Soldering and Surface Mount Technology

Volumn 11, Issue 2, 1999, Pages 7-11

  Stennett, A D ^a   Whalley, D C ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONTACTS; ELECTROCHEMISTRY; ETCHING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; REMELTING; REPAIR; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS;

DESOLDERING;

SURFACE MOUNT TECHNOLOGY;

EID: 0032666152     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919910265622     Document Type: Article

References (6)

1. EEC (1998), "Draft proposal for a directive on waste from electrical and electronic equipment".
2. Fidan, I., Kraft, R.P., Ruff, L.E. and Derby, S.J. (1996), "Designed experiments te analyse the solder joint quality output of a SMD remanufacturing system", Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology Symposium, Austin, TX, Oct 14-16, pp. 422-9.
3. Geren, N. and Redford, A.H. (1994), "The significance of desoldering and resoldering methods in robotic automated rework", Journal of Electronics Manufacturing, Vol. 4, pp. 41-51.
4. Harris, P.G., Whitmore, M.A., Fairweather, B. and Dunn, B.D. (1992), "Stripping and replacement of damaged solderable coatings", Soldering and Surface Mount Technology, No. 12, October, pp. 21-6.
5. Klein Wassink, R.J. (1989a), Soldering in Electronics, second edition, Electrochemical Publications Ltd., p. 155.
6. Klein Wassink, R.J. (1989b), Soldering in Electronics, second edition, Electrochemical Publications Ltd., p. 582.