Evaluation of fluorinated polyimide etching processes for optical waveguide fabrication

Thin Solid Films

Volumn 341, Issue 1, 1999, Pages 192-195

  Kim, J H ^a   Kim, E J ^a   Choi, H C ^a   Kim, C W ^a   Cho, J H ^a   Lee, Y W ^a   You, B G ^a   Yi, S Y ^a   Lee, H J ^a   Han, K ^a   Jang, W H ^a   Rhee, T H ^a   Lee, J W ^b   Pearton, S J ^b  

^a SAMSUNG Electronics   (South Korea)

^b UNIVERSITY OF FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC HUMIDITY; FLUORINE CONTAINING POLYMERS; INTEGRATED CIRCUIT MANUFACTURE; OPTICAL COMMUNICATION; OPTICAL WAVEGUIDES; OXYGEN; PLASMA ETCHING; PLASMAS; POLYIMIDES; PRESSURE; REACTIVE ION ETCHING; THERMODYNAMIC STABILITY;

CHAMBER PRESSURE; ETCH PROFILE; ETCH RATE; FLUORINATED POLYIMIDE; INDUCTIVELY COUPLED PLASMA ETCHING; OPTICAL WAVEGUIDE FABRICATION; RADIO FREQUENCY CHUCK POWER; WAVEGUIDE CHANNELS;

THIN FILMS;

EID: 0032665568     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(98)01554-5     Document Type: Article

References (5)

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