Thermal inspection of solder quality of electronic components

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3700, Issue , 1999, Pages 93-98

  Varis, Jussi ^a   Lehtiniemi, Reijo ^a   Vuohelainen, Reijo ^a  

^a UNIVERSITY OF HELSINKI   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CAMERAS; ELECTRONIC EQUIPMENT; INSPECTION; NONDESTRUCTIVE EXAMINATION; SOLDERING ALLOYS; TEMPERATURE;

ELECTRONIC COMPONENTS; PHOTOTHERMAL RADIOMETRY; SOLDER QUALITY; THERMAL INSPECTION;

INFRARED IMAGING;

EID: 0032665198     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)