Optical pressure sensor head fabrication using ultra-thin silicon wafer anodic bonding

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3680, Issue II, 1999, Pages 773-782

  Beggans, Michael H ^a   Ivanov, Dentcho I ^a   Fu, Steven G ^a   Digges Jr , T G ^a   Farmer, K R ^a  

^a NEW JERSEY INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COST EFFECTIVENESS; FIBER OPTIC SENSORS; MICROELECTROMECHANICAL DEVICES; MICROPROCESSOR CHIPS; SILICON WAFERS; ULTRATHIN FILMS;

ANODIC BONDING; FUSION BONDING; OPTICAL PRESSURE SENSORS;

INTEGRATED OPTOELECTRONICS;

EID: 0032665175     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.341272     Document Type: Conference Paper

References (9)