Significant improvement in electromigration of reflow-sputtered A1-0.5wt%Cu/Nb-liner dual damascene interconnects with low-k organic SOG dielectric

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1999, Pages 221-226

  Usui, T ^a   Watanabe, T ^a   Ito, S ^a   Hasunuma, M ^a   Kawai, M ^a   Kaneko, H ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; CRYSTAL MICROSTRUCTURE; ELASTIC MODULI; ELECTROMIGRATION; FAILURE ANALYSIS; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUIT TESTING; OPTICAL MICROSCOPY; PASSIVATION; RELIABILITY; TENSILE STRESS; TRANSMISSION ELECTRON MICROSCOPY;

ALUMINIUM INTERCONNECTS; DUAL DAMASCENE INTERCONNECTS; ELECTROMIGRATION TESTING; FAILURE SITES; MEDIAN TIME TO FAILURE; SPIN-ON GLASS;

LSI CIRCUITS;

EID: 0032663589     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (19)