Optimizing the integration of an electronics system into an existing enclosure using CFD modeling techniques

International Journal of Microcircuits and Electronic Packaging

Volumn 22, Issue 2, 1999, Pages 146-151

  Lober, David ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COMPUTER SOFTWARE; COOLING; FANS; OPTIMIZATION; PERFORMANCE; PRODUCT DESIGN; THERMOANALYSIS;

COOLING FANS; ELECTRONIC SYSTEM; NOISE LEVEL TEST; SYSTEM FAN PERFORMANCE TEST; THERMAL MANAGEMENT; THERMAL MODEL;

COMPUTER SYSTEMS;

EID: 0032662909     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. Frank P. Incropera, David P. Dewitt, "Fundamentals of Mass and Heat Transfer", John Wiley & Sons, Inc., Third Edition, New York, 1991.
2. D. S. Steinberg, "Cooling Techniques for Electronic Equipment", John Wiley & Sons, Inc., New York, 1991.
3. Gordon N. Ellison, "Thermal Computations for Electronic Equipment", Krieger Publishing Company, Malabar, Florida, 1989.