High performance packaging system for superconducting electronics

IEEE Transactions on Applied Superconductivity

Volumn 9, Issue 2 PART 3, 1999, Pages 3668-3671

  Gaidarenko, Dmitri ^a   Robertazzi, Ray ^a  

^a HYPRES INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; CRYOGENICS; DEGAUSSING; DEWARS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; JOSEPHSON JUNCTION DEVICES; MAGNETIC SHIELDING; PROBES;

CRYOPACKAGE; DEFLUXING OPERATION; HIGH PERFORMANCE PACKAGING SYSTEM; SUPERCONDUCTING DIE; SUPERCONDUCTING ELECTRONICS;

CRYOTRONS;

EID: 0032659532     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/77.783824     Document Type: Article

References (2)

1. S. Rylov, D. Brock, D. Gaidarenko, A,Kirichenko and J. Vogt, "High Resolution ADC Using Phase Modulation-Demodulation Architecture," IEEE Trans. Appl. Supercond. , in press.
2. S. Kaplan, P. Bradley, D. Brock, D. Gaidarenko, D. Gupta, W-Q. Li and S. Rylov, "A Superconductive Flash Digitizer with On-Chip Memory," IEEE Trans. Appl. Supercond. , in press.