Microstructure of Cu-C interface in Cu-based metal matrix composite

Sensors and Actuators, A: Physical

Volumn 74, Issue 1, 1999, Pages 86-90

  Berner, A ^a   Mundim, K C ^b   Ellis, D E ^b   Dorfman, S ^a   Fuks, D ^c   Evenhaim, R ^c  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^b NORTHWESTERN UNIVERSITY   (United States)

^c BEN GURION UNIVERSITY OF THE NEGEV   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON FIBERS; CHEMICAL BONDS; COPPER; ELECTRONIC STRUCTURE; INTERFACES (MATERIALS); METALLIC MATRIX COMPOSITES; SCANNING ELECTRON MICROSCOPY; SIMULATED ANNEALING; SOLID SOLUTIONS;

ATOMISTIC SIMULATIONS; INTERACTION ZONE; OCTAHEDRAL POSITION;

MICROSTRUCTURE;

EID: 0032656847     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)00307-0     Document Type: Article

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