Thermal van der Pauw test structure

IEEE International Conference on Microelectronic Test Structures

Volumn , Issue , 1999, Pages 56-61

  Paul, O ^a   Plattner, L ^a   Baltes, H ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CMOS INTEGRATED CIRCUITS; ELECTRIC CURRENTS; ELECTRIC RESISTANCE MEASUREMENT; SEMICONDUCTOR DEVICE TESTING; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EFFECTS;

THERMAL VAN DER PAUW TEST STRUCTURES;

SEMICONDUCTING FILMS;

EID: 0032653587     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (19)