Evolution of interface in pulsed electrode deposited titanium diboride on copper and steel

Surface Engineering

Volumn 15, Issue 1, 1999, Pages 27-32

  Agarwal, A ^a   Dahotre, N B ^a   Sudarshan, T S ^b  

^a UNIVERSITY OF TENNESSEE SPACE INSTITUTE   (United States)

^b MATERIALS MODIFICATION INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRODEPOSITION; MICROSTRUCTURE; PULSED LASER APPLICATIONS; STEEL; SURFACE TREATMENT; THERMODYNAMIC PROPERTIES; TITANIUM COMPOUNDS; WETTING;

MICROWELDING SURFACING; PULSED ELECTRODE SURFACING; TITANIUM DIBORIDE; WETTABILITY;

INTERFACES (MATERIALS);

EID: 0032653564     PISSN: 02670844     EISSN: None     Source Type: Journal    
DOI: 10.1179/026708499322911601     Document Type: Article

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