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Volumn 30, Issue 3, 1999, Pages 339-348

A mesoscopic scale analysis of the reaction-bonded SiC process

Author keywords

B. Mechanical properties; Reaction bonded SiC

Indexed keywords

BONDING; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; REACTION KINETICS;

EID: 0032652124     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-835X(98)00164-X     Document Type: Article
Times cited : (3)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.