Creep of fully lamellar near -y-TiAl intermetallics

Materials Research Society Symposium - Proceedings

Volumn 552, Issue , 1999, Pages

  Beddoes, J ^a   Zhao, L ^a   Chen, W R ^a   Du, X ^a  

^a CARLETON UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COOLING; CREEP; CREEP TESTING; GRAIN BOUNDARIES; MORPHOLOGY; PRECIPITATION (CHEMICAL); SILICON COMPOUNDS; THERMAL EFFECTS; TITANIUM COMPOUNDS;

CREEP RESISTANCE; STEPPED COOL; TITANIUM ALUMINIDE INTERMETALLICS;

INTERMETALLICS;

EID: 0032652036     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

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