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Volumn 38, Issue 3 A, 1999, Pages 1303-1309
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Temperature effects on the structure of polycrystalline silicon films by glow-discharge decomposition using SiH4/SiF4
a a a a |
Author keywords
Addition of fluorine; Crystallinity; Deposition temperature; Plasma CVD; Poly Si films; Surface morphology
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Indexed keywords
CHEMICAL BONDS;
COMPOSITION EFFECTS;
CRYSTAL STRUCTURE;
DECOMPOSITION;
FILM PREPARATION;
FLUORINE COMPOUNDS;
GLOW DISCHARGES;
GRAIN SIZE AND SHAPE;
MATHEMATICAL MODELS;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
STRUCTURE (COMPOSITION);
TEMPERATURE;
BOND DENSITY;
CRYSTALLINE QUALITY;
GLOW DISCHARGE DECOMPOSITION;
POLYCRYSTALLINE SILICON FILMS;
STRUCTURAL PROPERTIES;
SEMICONDUCTING SILICON;
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EID: 0032651543
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.38.1303 Document Type: Article |
Times cited : (7)
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References (12)
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