Effects of Al additive on the mechanical and physical properties of silicon reinforced copper matrix composites

Scripta Materialia

Volumn 41, Issue 7, 1999, Pages 773-778

  Lee, Yuang Fa ^a   Lee, Sheng Long ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ALUMINUM; COPPER POWDER; DENSIFICATION; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; SILICON; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION; VOLUME FRACTION;

SILICON REINFORCED COPPER MATRIX COMPOSITES;

METALLIC MATRIX COMPOSITES;

EID: 0032646180     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(99)00216-X     Document Type: Article

References (13)

1. Tummala R.R. J. Am. Ceram. Soc. 74:1991;895.
2. C. Zweben, JOM. July, 15 (1992).
3. Shen Y.L., Needleman A., Suresh S. Metall. Mater. Trans. A. 25A:1994;839.
4. German R.M., Hens K.F., Johnson J.L. Int. J. Powder Metall. 30:1994;205.
5. M. K. Premkumar, W. H. Hunt, Jr., and R. R. Sawtell, JOM, July, 24 (1992).
6. Yih P., Chung D.D.L. J. Mater. Sci. 31:1996;399.
7. C. A. Achete, F. L. Freire Jr, G. Mariotto, and E. Zang Hellini, Mater. Lett. 18, 218 (1994).
8. L. Anantha Narayanan, F. H. Samul, J. E. Gruzleski, Metall. Mater. Trans. A. 26A, 2161 (1995).
9. Samuel A.M., Gauthier J., Samul F.H. Metall. Mater. Trans. A. 27A:1996;1785.
10. Yih P., Chung D.D.L. Int. J. Powder Metall. 31:1995;335.
11. Levin L., Atzmon Z., Katsman A., Werber T. Mater. Chem. Phys. 40:1995;56.
12. Veer F.A., Kolster B.H., Burgers W.G. Trans. Metall. Soc. AIME. 242:1968;669.
13. German R.M. Powder Metallurgy Science, 2nd edn. 1994;389 Metal Powder Industries Federation, NJ.