Stress singularity approach for the prediction of fatigue crack initiation in adhesive bonds. Part 2: Experimental

Journal of Adhesion

Volumn 70, Issue 1, 1999, Pages 139-154

  Lefebvre, D R ^a,b   Dillard, D A ^a   Dillard, J G ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINUM; BIMETALS; CRACK INITIATION; EPOXY RESINS; FATIGUE OF MATERIALS; INTERFACES (MATERIALS); PLASTIC ADHESIVES; STRAIN GAGES; STRESS INTENSITY FACTORS; THERMAL EXPANSION; THERMAL STRESS;

STRESS SINGULARITY APPROACH; THERMAL EXPANSION COEFFICIENT;

ADHESIVE JOINTS;

EID: 0032645997     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218469908010491     Document Type: Article

References (10)

1. Lefebvre, D. R. and Dillard, D. A., "A Stress Singularity Approach for the Prediction of Fatigue Crack Initiation in Adhesive Bonds. PART 1: Theory". Companion paper, this issue.
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